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SystemFabriCore

 The First, and Next Step in Hyper-Efficient Computing
The SystemFabricCore is an Ultra Dense, Ultra Low Power Computing Platform based on a revolutionary new approach to highly parallel, densely packaged, tightly integrated systems utilizing the Calxeda EnergyCore™ SOC (System on a Chip) which delivers computing, fabric, network, storage I/O and management, all in one 3.8 watt SOC as opposed to a traditional x86 motherboard based architecture using 100s of watts.   

The SystemsFabricCore is a self contained, highly extensible, multi-node cluster with integral high- speed interconnect and storage within a standard 2U rackmount enclosure. Available up to 48 SoC components delivered on 12 Calxeda EnergyCard platforms
• Each Calxeda EnergyCore™ SoC contains a quad-core processing unit, providing a total of 192 cores per 2U enclosure • 24 x 2.5” SATA HDDs or SSD devices
• 4 x 4GB miniDIMM modules per EnergyCard, providing a total of 192GB
of RAM per 2U enclosure
• Rear I/O supporting 4 x SFP+ cages for external fabric connectivity (1Gbe or 10Gbe depending on configuration and number of Energy Cards) and 1 x serial port for management.

FEATURES:
Easily scalable to thousands of nodes
Calxeda EnergyCore™ SoC Redefines Big
        Data Efficiency
Each EnergyCore™ contains an ARM® Cortex™-A9
        Quad-core CPU 
Up to 10X the performance in the same power and   
        space
Cuts energy use and space by up to 90%
Industry leading low power consumption 
        3.8 watts per SoC
Up to 24 SATA HDDs or SSD per 2U
Up to 192GB of RAM per 2U enclosure
Total of 192 cores per 2U

SystemFabriCore Software               

*** Click image for versions and details***

SystemFabriCore Management               
  • Dedicated embedded processor for systems management 
  • Advanced power management with dynamic power capping 
  • Dedicated Ethernet MAC for out-of-band communication 
  • Supports IPMI 2.0 and DCMI management protocols 
  • Remote console support via Serial-over-LAN (SoL)
SystemFabriCore - Energy Core Module
  • Up to four ARM® Cortex™-A9 cores @ 1.1 to 1.4 GHz
  • NEON® extensions for multimedia and SIMD processing
  • Integrated FPU for floating point acceleration
  • TrustZone® technology for enhanced security
  • Individual power domains per core to reduce power  draw
  • 32 KB L1 instruction cache per core
  • 32 KB L1 data cache per core
  • 4 MB shared L2 cache with ECC 
  • 72-bit DDR controller with ECC support
  • 32-bit physical memory addressing
  • DDR3 (1.5V) and DDR3L (1.35V) at 800/1066/1333 MT/s
Specifications subject to change.